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Trying to say this correctly; that software can be trusted and it’s of the high quality. it also provide the beginner user with a great learning tool when using the software. Of course there is an exception in some market where the scam software is higher rate than the legit ones.The present invention relates to a semiconductor apparatus and, more particularly, to a semiconductor apparatus having a through electrode.
A metal wiring pattern is provided on the surface of a semiconductor device, such as an IC or LSI, on a substrate or a lead frame. However, when a wiring pattern is formed on the surface of a semiconductor device, there is a problem in that the wiring pattern corrodes the electrode or chip, or short-circuits the wiring pattern and the electrode because the environment is acidic. This problem has been resolved by forming a silicon protective film on the surface of the semiconductor device.
Also, an improved ceramic green sheet for making a multilayer ceramic has been developed and this green sheet is used for forming wiring patterns for mounting thereon a semiconductor device. This green sheet is used, for example, to make a wiring pattern for a lead frame. A problem has arisen when such a green sheet is used because in this case, the wiring pattern does not completely make contact with the green sheet.
Thus, in order to increase the electrical connection between a metal wiring pattern and the semiconductor device, which is called the bump, a through electrode is generally provided.
Also, in a semiconductor apparatus where through electrodes are used, the electrodes are brought into contact with each other via a conductive adhesive agent by means of a face-down mounting method.
However, the density of the wiring pattern in the semiconductor device has increased because of high integration, higher operating speed and mass production, and miniaturization of the wiring pitch is being advanced. In this case, the width of a via hole to be formed in the green sheet becomes narrow as miniaturization of the wiring pattern advances. Therefore, the via hole may be formed smaller than the diameter of a lead inserted in the via hole.
In this manner, the through hole has a small diameter and because of this, the conductive adhesive agent that fills the via hole is prevented from wetting the bottom surface of the via hole. Therefore, the through electrode does not make contact with the electrode that is deposited in the via hole, and the electrical connection between the through electrode and the electrode is poor, thereby deteriorating the yield in
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